To filmy laser beam machining

Current, the typical lifestyle of the developed country cannot leave cheap electronic facility, various functions by compositive in a cabinet equipment. For example, player of mobile phone, portable music, GPS, PDA and notebook computer, without number (if pursue 1) . For cabinet to producing nicety electron equipment, the most important is the dimension of component of the electron in contractible equipment. In the development of component miniaturization, what people pays close attention to most is the miniaturization of different type transistor. The working principle hang on of this component is adulterated the electricity of material is characteristic, this action is almost in atomic weight class. This is in with respect to limits of effect of be patient of limits of rice of a few accept, the door measure that at present groovy integrated circuit place uses transistor is 45 Nm. So small size makes in same countless transistor can be installed on chip. Graph 1, high nicety and the requisite that cabinet electronic equipment makes daily living. Although main element reduced volume,had been a significant technical progress, but the electronic element that still has a lot of other, because the physics of component function is characteristic, their miniaturization process is more complex. Capacitance and inductance are very good example. In these component, the function of component is direct by physical parameter (macroscopical parameter) will decide. This expressive formula from capacitance and inductance can see apparently. Formula makes clear, to smooth andante capacitor and solenoid inductor, these numerical value are overt as their geometry character -- area (A) , distance (D) with length () change and change. From film capacitor anatomical the geometrical payoff that can see capacitor apparently, if the graph is shown 2 times,stick a component. Graph 2, the typical internal composition that sticks a capacitor and it although the capacitor of other type already was come out by development, they may have higher energy density, but simple multilayer capacitor of type, smooth andante still is answered in frequency and equivalent resistor (ESR) the respect has its advantage, accordingly it is the first selection in a lot of application. To make the dimension of electronic equipment smaller, also must narrow macroscopical discrete element, be like capacitance and inductance. What using the most effective method at present is to stick a technology, this technology cancels wiring not only implement use, and the automation computation that suits circuit edition more. Normally, small-sized the physical configuration that sticks a capacitance gives out by a code, this code gives out the dimension of the X of capacitance and Y direction, the unit is 1/100 inch. Such, the dimension of 0402 series capacitor is 4/100 inch × 2/100 inch (or: 1 × 0.

5 Mm) . Graph 3, the sketch map of film capacitor is in actual application, the structure of film capacitor is made by the high polymer film of a lot of layers, the plating on high polymer film has a metal. Normally, this metal is aluminium. High polymer film can have all sorts of different choices, be like polypropylene (PP) , polyester (PE) , polystyrene (PS) and get together benzene sulfur aether (PPS) . Graph the 3 sketch map that are film capacitor (for finer demonstrative structure, we are in each between adscititious removed) . In traditional manufacturing industry technique, this structure is to pass will two already of metallization get together more content is filmy at the same time winding rises and come true, get together more there has been insulation track on content film. Because capacitance value is direct related to insulation orbit span, because the electricity character of this capacitor is,by capacitor the orbit in hundreds of layer is apart from can retentive accuracy will decide. Reduce as the dimension of capacitor (electricity tolerance is reduced) , the accuracy when maintaining capacitance winding becomes serious technical problem. In addition, undertake machining having very great difficulty originally to so small matter, if once the word of drawing, the electricity of metallization layer is successional can reduce, the electricity function of capacitor is destroyed. Nextpage pursues 4, because stimulate the base that place of luminous intensity excessive brings about to destroy (the dot) among, the base that brings about as a result of silicon grain is destroyed (the dot) of or so both sides. Another limitation of traditional processing technique is how to machine insulation orbit. It is on the tradition get together more through be in content film adds film of osculatory attack by surprise to come true in metallization process. Accordingly, film of this attack by surprise is only " thin band " , by park material surface. Once metallic layer deposit is in material surface, "Thin band " be taken out, form insulation orbit thereby. In actual production, a lot of conditions were restricted " thin band " dimension, also restricted insulation orbital width. This brings about the actual width that orbital width needs more than, because this wasted the valid area of capacitor. In addition, film of needs attack by surprise is exceedingly thin change easily also bend, make it very difficult operation, yi Shen piece, attaint, broken perhaps. In addition, when taking out film of attack by surprise, pull metallic layer easily bad, bring about metallic layer to break away from even. Development of company of dentate brim OpTek Systems goes a new processing technique. This technology used laser to be opposite directly before capacitance is winding insulation orbit undertakes machining. This technology has the advantage of a lot of respects, included orbit width optimize, this makes capacitance more cabinet, the wasteful circumstance of valid area is fewer. Other dominant position still includes: The winding of capacitance is more convenient; Capacitance value is more exact; The difference between layer and layer is less; Running stores cost is reduced, need the belt that is isolated from beforehand no longer, such seed profit is produced with respect to leave out memory a variety of going to the trouble of metal tape. Drossy graph 5, dentate brim (on graph) and drossy (next graphs) metropolis bring about increase. The accurate treatment that OpTek company is laser material (small treatment) offer different systematic kimono Wu, it is good at a change of technology of laser beam machining that has difficulty extremely be large-scale manufacturing technology. This company is not laser production business, so it does not have any preferences on the choice of of all kinds laser. Accordingly it can choose most appropriate laser, and be in any appropriate treatment parameter is chosen in given applying. When implementation machines a purpose, still difficult problem of a few technologies needs to solve. Can consider from 3 following respects. It is to the destruction of base material in capacitor, get together more insulation and the double action that serve as dielectric reach since content layer. Accordingly, to giving the capacitor of bulk, to increase capacitance cost, get together more normally content layer is inside limit of its electricity function, it is good to jump over Bao Yue as far as possible, this brings very big impact with respect to the performance that gives dielectric the layer. Insulation (compression) function is not OK because of laser beam machining change somewhat. Additional, dielectric is in all likely job frequency paragraph answer also cannot change somewhat. Because data is very weak, brittle, so afore-mentioned requirement brought a technology to challenge to process of laser beam machining. Graph 6, brim thickening makes filmy capacitance cannot coil. More complex is, as a result of base get together more content film is contained very small (bulbiform) silicon grain, these little grain introduce designedly when treatment, so that raise filmy machine " slip function " , make it easier handle and curly. From optical angle for, these little grain had the effect of bulbiform lens inside very wide wave band, they may bring bigger local change to laser intensity. Additional, they are changed possibly also as a result of what blow up and bring base (see a picture 4) . Graph 7, the track that uses laser technology to undertake the metal operates earning to arrive going did not appear any base are destroyed, the brim is dentate or the case of thickening, also do not have any drossy. If have very sharp edge,enhance metallic layer, will bring about bureau region electric field to increase, make the effective report pressure ratio of capacitance is reduced. Metallic layer is existing certainly without avoidable the brim, but brim of dentate, filar, or the metal is drossy grain is must avoid to the utmost (see a picture 5) . The note is last bits, process of laser beam machining can not affect capacitor measure of winding of hundreds of storied. Be based on this to think, metallic layer is on the brim thickening is not concessional those who happen. Choose parameter of appropriate laser beam machining to be able to avoid all negative effect. Graph 7 gave out to be in 1.

A 20 M goes widely after the metal orbit. See by the graph, this treatment does not have any destruction to base; Orbit brim also is done not have toothed or thickening, not any apparent drossy. This processing technique by compositive go up to a winding and special machine, every machine produces 1 ten million every year capacitance. Current, photoelectricity industry uses laser to go metallization technology comes mass production is flexible presswork solar battery. CNC Milling